ESA Open Bidding Space 3D Printed Circuit Board R&D Project

For the use of 3D printing technology and equipment in space is not new, we only reported in December last year that the International Space Station (ISS) received the first European space 3D printer information. Recently, the European Space Agency (ESA) commissioned four European technology companies to develop test circuit board additive manufacturing equipment for ISS, which will be used for experimental research on 3D printed circuit boards in space.

The project, called Project MELT, was launched by two German companies (Active Space GMBH and OHB Systems AG) and two Portuguese companies (Active Space SA and BEEVERYCREATIVE).

The four companies will work together to design a 3D printer that can make test boards that must adapt to the microgravity environment inside the International Space Station. In addition, the machine requires an engineered polymer capable of 3D printing on the surface of the board with excellent mechanical and thermal properties.

It is understood that this project was officially launched at the end of 2014. In fact, after winning the European Space Agency's public bidding, the four companies began to work on this research, the specific time should be June 2014. According to the plan, the final test board 3D printer will be completed in May 2017, during which time the development team needs technical improvement and continuous testing, as well as hardware and software optimization.

Advances in current PCB 3D printers have proven that 3D printed functional boards and electronics are possible, opening a new path for 3D printing in consumer electronics, military, and even today's applications in space.

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