Development of Room Temperature Curing High Temperature Adhesive

3.2 Adhesive resistance to media performance assessment

After curing the adhesive for 1d, test the shear strength at room temperature after soaking in different media for 30 days. See Table 7:

As can be seen from Table 7, the adhesive is excellent in media resistance.

3.3 Adhesion to Different Materials

4 Conclusion

The adhesive uses epoxy resin modified by hydroxyl-terminated silicon-boron resin to improve the heat resistance of the host resin; and the self-made high-activity heat curing agent B is coordinated with the low-molecular polyamide to cure, and an appropriate accelerant is added, so that the system can Slightly lower than room temperature, the curing is complete; the mixed heat-resistant filler activated by the coupling agent has a prominent effect on improving the ablation resistance of the adhesive. The adhesive is cured at room temperature and reaches its maximum strength for a long period of time. It has excellent heat resistance, especially excellent heat aging resistance, has a certain degree of toughness, and has good adhesion to a variety of materials. Can be widely used in aviation, aerospace structural parts bonding.

(Author/ Guan Changshen, Zhang Xugang, Sun Mingming, Zhang Bin, Wang Chao, Li Qili

Heilongjiang Institute of Petroleum Chemistry

China Adhesive Industry Information Network